Industries /
ELECTRIC / ELECTRONIC MANUFACTURING

Bonding of sensor housings Electronic board/components, stabilisation or sealing during battery production.

Bonding of sensor housings Electronic board/components, stabilisation or sealing during battery production.

For sensitive electronic elements and connectors balti offers the low pressure potting of non-reactive adhesives as well as, uniquely, reactive hotmelt. Tank and granulate melting systems such as extruder technology for adhesives in block or granulate form for mostly polyamides or bag and barrel melting systems for reactive PAR materials with partly integrated injection control inject the hotmelt in a controlled way in single and multiple moulds of manual and automatic OEM and end customer systems. In a specially developed process the adhesive can also be coloured in-line.

Sensitive electrical and electronic parts on printed circuit boards (PCB) are protected with lacquers as well as resins and other media with a thermoplastic behaviour. Even, if it is only a protection against possibly forming condensation water, hotmelt offers the advantage of covering or stabilizing components with manual or fully automatic systems in a single process step and with a small investment.