Hotmelt technology in the electrical and electronics manufacturing industry

For sensitive electronic components and connectors, balti offers low-pressure casting processes using non-reactive adhesives as well as, uniquely, reactive hot melt. Tank and granulate melting systems, such as extruder technology for adhesives in block or granulate form, mostly for polyamides, or bag and drum melting systems for reactive PAR materials, some with integrated injection control, inject the hot melt in a controlled manner into single and multiple tools from manual and automatic OEM and end customer systems. In a specially developed process, the adhesive can also be colored in-line.

Sensitive electrical and electronic components on printed circuit boards (PCBs) are protected with coatings, resins, and other thermoplastic materials. Even if it is only protection against condensation that may form, hot melt offers the advantage of covering or stabilizing components in a single process step using manual or fully automatic systems and with little investment.